Self-propagating exothermic reaction assisted Cu clip bonding for effective high-power electronics packaging

For the high-power modules packaging, Cu clip bonding has gained growing interest to replace multiple wire-bonding for benefits of lower resistance and improved thermal performance, which is especially beneficial higher reliability. However, current interconnection materials processes cannot fully meet reliability requirements emerging integrated structure. Brazing alloys can serve in high-temperature conditions, since they have melting points above 450 °C. very limited brazing been applied electronics packaging processing temperature also high if needs be melted. It promising develop low-temperature technology at temperatures. In this study, incorporating with Cu-15Ag-5P alloy as material, self-propagating exothermic reaction (SPER) assist process, provides intense local heating achieve interconnects millisecond scale. The mechanism between substrate examined discussed. research findings promise an effective assembly route viable application packaging.